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LPDDR5LPDDR4eMMCUFSDDR4SSDModuleSamsungLPDDR5LPDDR4eMMCUFSDDR4SSDModuleMicronLPDDR5LPDDR4eMMCUFSDDR4SSDModuleSK hynixLPDDR4LPDDR3DDR4DDR3eMCPNanyaSLC NANDSPI NANDeMMCMCPSkyhighPPI MRAMSPI MRAMSRAMMRAM KGDNetsolSLC NANDSPI NANDeMMCUFSKioxiaRGB MCUMotor MCUElectrical MCUGeneral MCUDemoKitSynwitAgilex™ FPGAStratix® FPGAArria® FPGAMAX® FPGACyclone® FPGAAlteraSpartan-7 FPGAsArtix-7 FPGAsKintex-7 FPGAsVirtex-7 FPGAsXilinxeMMCeMCPSSDKingstonLPDDR5LPDDR4eMMCDDR4RaysonpSRAMSDRAMDDR2DDR3DDR KGDPiecemakersNor FlashSPI NANDSLC NANDDDRWinbondNOR FlashSLC NANDSPI NANDeMMCMXICeMMCeMCPLPDDR3KowineMMCSSDSandiskSecurity chipSecurity MCUeSIMHEDNOR FLASHNAND FLASHBoya MicroMCUNor FlashZbitsemiRunjetic MCUSecurity chipRunjeticSecurity chipKGDIDKTSecurity chipGEN-FNeowine(ALPU)CMOS SensorPixart
News Detail

SAMSUNG: eMMC parts

4
Issuing time:2024-03-19 13:57Author:GlobalizeX.COMSource:GlobalizeX.COMLink:http://www.globalizex.com/news/
Version
Density
Voltage
Interface
Package Size
Temperature
Product Status
KLMCG1RCTE-B041
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMDG2RCTE-B041
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMCG2UCTB-B041
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMDG4UCTB-B041
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLM4G1FETE-B041
eMMC 5.1
4 GB
1.8 / 3.3 V
HS400
11 x 10 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLM8G1GEUF-B04P
eMMC 5.1
8 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 85 °C
Mass Production
KLM8G1GEUF-B04Q
eMMC 5.1
8 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 105 °C
Mass Production
KLMAG2GEUF-B04P
eMMC 5.1
16 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 85 °C
Mass Production
KLMAG2GEUF-B04Q
eMMC 5.1
16 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 105 °C
Mass Production
KLMBG4GEUF-B04P
eMMC 5.1
32 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 85 °C
Mass Production
KLMBG4GEUF-B04Q
eMMC 5.1
32 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 105 °C
Mass Production
KLM8G1GETF-B041
eMMC 5.1
8 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMAG1JETD-B041
eMMC 5.1
16 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMBG2JETD-B041
eMMC 5.1
32 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMCG4JETD-B041
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLMCG4JEUD-B04P
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLMCG4JEUD-B04Q
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLMDG8JEUD-B04P
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLMDG8JEUD-B04Q
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production


Note： https://www.globalizex.com/h-nd-550.html
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